ʻO ke kuleana o nā ipu hao a me nā plungers i ka hui ʻana o ka pahu semiconductor packaging mold

 He kaʻina koʻikoʻi ka paʻi Semiconductor i ka ʻoihana uila, kahi i hoʻopili ʻia ai nā kaʻa i hoʻohui ʻia e pale aku iā lākou mai nā mea o waho e like me ka lepo, ka lepo, a me ka pōʻino kino. ʻO kahi ʻāpana koʻikoʻi o ka hui ʻana o ka semiconductor packaging mold ʻo nā ipu a me nā plungers i hana ʻia mai ka tungsten carbide. He kuleana koʻikoʻi kēia mau mea i ka hōʻoia ʻana i ka maikaʻi a me ka hilinaʻi o ke kaʻina hana semiconductor packaging.

  ʻO Tungsten carbide kahi mea paʻa loa a paʻa i ka lole i kūpono no ka hana ʻana i nā ipu hao a me nā plungers i hoʻohana ʻia i ka ʻeke semiconductor. ʻO ka paʻakikī kiʻekiʻe a me ka ikaika o ka tungsten carbide e kūpono ia no ka pale ʻana i nā kiʻekiʻe kiʻekiʻe a me nā mahana e pili ana i ke kaʻina hana semiconductor packaging. Hoʻohui ʻia, loaʻa i ka tungsten carbide ka conductivity thermal maikaʻi loa, e kōkua ana i ka mālama ʻana i ka hāʻawi ʻana o ka mahana i ka wā o ke kaʻina encapsulation.

ʻO nā ipu a me nā plungers nā mea koʻikoʻi o ka hui mold i hoʻohana ʻia i ka ʻeke semiconductor. Hoʻohana ʻia nā ipu e hoʻopaʻa i nā mea encapsulant, e like me ka epoxy resin a i ʻole ka hoʻohuihui ʻana, i ka wā o ke kaʻina encapsulation. ʻO nā plungers, ma ka ʻaoʻao ʻē aʻe, hoʻohana ʻia no ka hoʻopili ʻana i ke kaomi i ka mea encapsulant e hōʻoia i ka hoʻopiha piha ʻana i ka lua mold a kūlike. He mea koʻikoʻi nā ipu ʻelua a me nā plungers no ka hoʻokō ʻana i ka encapsulation kiʻekiʻe a me ka hōʻoia ʻana i ka hilinaʻi o nā mea semiconductor i hoʻopili ʻia.

ʻO ke kuleana o nā ipu i loko o ka hui semiconductor packaging mold e hāʻawi i kahi pahu no ka paʻa ʻana i ka mea encapsulant. Hana ʻia nā ipu mai ka tungsten carbide ma muli o ko lākou paʻakikī kiʻekiʻe a me ke kūpaʻa ʻana, e hōʻoia i ka hiki i nā ipu ke kū i ke ʻano abrasive o nā mea encapsulant. Hoʻolālā ʻia nā ipu e loaʻa i nā ana kikoʻī a me ka hoʻopau ʻana o ka ʻili e hōʻoia i ka holo ʻana o ka mea encapsulant me ka maʻalahi i ka wā o ke kaʻina encapsulation. E kōkua ana kēia i ka pale ʻana i nā haʻahaʻa, nā ʻōhū ea, a me nā hemahema ʻē aʻe o nā mea semiconductor encapsulated.

He kuleana koʻikoʻi ka Plungers i ka hui ʻana o ka pahu semiconductor packaging mold ma ke kau ʻana i ke kaomi i ka mea encapsulant e hōʻoia i ka hoʻopiha ʻana i ka lua mold. Hoʻolālā ʻia nā plungers e loaʻa i kahi kūpono kūpono me nā ipu e hana i kahi sila paʻa a pale i ka leakage o ka mea encapsulant. ʻOi aku ka maikaʻi o ka tungsten carbide plungers no ko lākou ikaika kiʻekiʻe a me ka lōʻihi, e hiki ai iā lākou ke hoʻohana i ke kaomi pono me ka ʻole o ka deforming a i ʻole ka haki ʻana i ke kaʻina hana encapsulation. ʻO ka mana pololei o ke kaomi e nā plungers e kōkua i ka hoʻokō ʻana i ka encapsulation like ʻole a hōʻoia i ka maikaʻi a me ka hilinaʻi o nā mea semiconductor paʻa.

I loko o ka hui hoʻoheheʻe semiconductor packaging, hana pū nā ipu a me nā plungers e hōʻoia i ka holomua o ke kaʻina hana encapsulation. Hoʻopaʻa nā ipu i ka mea encapsulant ma kahi, ʻoiai ke kau nei nā plungers i ke kaomi e hōʻoia i ka hoʻopiha ʻana o ka mea i ka lua mold. ʻO kēia hui pū ʻana o nā ipu hao a me nā plungers i hana ʻia mai ka tungsten carbide e kōkua i ka hoʻokō ʻana i ka encapsulation kiʻekiʻe me nā hemahema liʻiliʻi a hōʻoia i ka hilinaʻi o nā mea semiconductor i hoʻopili ʻia.

I ka hopena, ʻo nā ipu a me nā plungers i hana ʻia mai ka tungsten carbide nā mea koʻikoʻi o ka hui semiconductor packaging mold. Hāʻawi nā ipu i kahi pahu no ka hoʻopaʻa ʻana i nā mea encapsulant, aʻo nā plungers e hoʻopili i ke kaomi e hōʻoia i ka encapsulation like. Ma ka hoʻohana ʻana i nā ipu kiʻekiʻe a me nā plungers i hana ʻia mai ka tungsten carbide, hiki i nā mea hana hoʻopihapiha semiconductor ke hoʻokō i ka encapsulation hilinaʻi a hōʻoia i ka maikaʻi a me ka hilinaʻi o kā lākou mau mea hana semiconductor paʻa.

He mea nui ia e hoʻomaopopo i ka hana koʻikoʻi o nā ipu hao a me nā plungers i ka hui ʻana o ka semiconductor packaging mold. Ma ka hāʻawi ʻana i nā ipu a me nā plungers kiʻekiʻe i hana ʻia mai ka tungsten carbide, hiki i ka hui ʻo Zhuzhou Better Tungsten Carbide ke kōkua i nā mea kūʻai aku i ka ʻoihana uila e hoʻokō pono a kiʻekiʻe ka hana semiconductor packaging mold. ʻO kā mākou akamai i ka hana ʻana i ka tungsten carbide a me kā mākou kūpaʻa i ka maikaʻi e lilo mākou i hoa hilinaʻi no ka hoʻonā hui ʻana o ka semiconductor packaging mold assembly.