Basa remapoto uye plungers mune semiconductor packaging mold musangano

 Semiconductor packaging inzira yakakosha muindasitiri yemagetsi, uko maseketi akasanganiswa akavharirwa kuti avadzivirire kubva kune zvekunze zvinhu zvakaita sehunyoro, guruva, uye kukuvara kwemuviri. Chimwe chinhu chakakosha che semiconductor packaging mold musangano ihari nemaplungers akagadzirwa kubva ku tungsten carbide. Izvi zvikamu zvinoita basa rakakosha mukuona kunaka uye kuvimbika kweiyo semiconductor yekurongedza maitiro.

  Tungsten carbide inogara yakasimba uye isingapfeki zvinhu izvo zvakanakira kugadzira mapoto nemaplungers anoshandiswa mu semiconductor packaging. Kuomarara kwepamusoro uye kusimba kwe tungsten carbide inoita kuti ive yakakodzera kumirisana nekumanikidza kwakanyanya uye tembiricha inosanganisirwa mune semiconductor yekurongedza maitiro. Pamusoro pezvo, tungsten carbide ine yakanakisa yekupisa conductivity, iyo inobatsira kuchengetedza yunifomu yekugovera tembiricha panguva ye encapsulation process.

Pots uye plungers zvinhu zvakakosha zvemusangano wekuumbwa unoshandiswa mune semiconductor packaging. Mapoto anoshandiswa kubata iyo encapsulant zvinhu, senge epoxy resin kana molding compound, panguva ye encapsulation process. Iwo plungers, kune rumwe rutivi, anoshandiswa kuisa kumanikidza kune encapsulant zvinhu kuti ive nechokwadi chekuti inozadza mold cavity zvachose uye zvakafanana. Iri mbiri hari nemaplungers zvakakosha kuti uwane yepamusoro-yemhando encapsulation uye kuve nechokwadi chekuvimbika kweakaputirwa semiconductor zvishandiso.

Basa remapoto mu semiconductor packaging mold musangano ndeyekupa mudziyo wekubata iyo encapsulant zvinhu. Idzo hari dzinowanzo gadzirwa kubva ku tungsten carbide nekuda kwekuoma kwadzo uye kupfeka kuramba, izvo zvinoita kuti mapoto akwanise kumira neabrasive yemhando ye encapsulant zvinhu. Idzo hari dzakagadzirwa kuti dzive dzakanyatsoyera zviyero uye kupedzisa kwepamusoro kuti ive nechokwadi chekuti encapsulant zvinhu zvinoyerera zvakanaka uye zvakaenzana panguva ye encapsulation process. Izvi zvinobatsira mukudzivirira voids, mabhuru emhepo, uye kumwe kukanganisa mune yakavharirwa semiconductor zvishandiso.

Plungers inoita basa rakakosha mu semiconductor kurongedza mold musangano nekuisa kumanikidza kune encapsulant zvinhu kuti ive nechokwadi chekuti inozadza mold. Iwo maplungers akagadzirwa kuti ave nechaiyo inokwana nemapoto kuti agadzire chisimbiso chakasimba uye kudzivirira chero kuvuza kweiyo encapsulant zvinhu. Tungsten carbide plungers inosarudzwa nekuda kwesimba rayo repamusoro uye kusimba, izvo zvinovatendera kuti vashandise kudzvanywa kwakakodzera pasina kukanganisa kana kutyora panguva ye encapsulation process. Iko kunyatso kudzora kwekumanikidza nema plungers kunobatsira kuwana yunifomu encapsulation uye inova nechokwadi chemhando uye kuvimbika kweiyo yakaiswa semiconductor zvishandiso.

Mune semiconductor packaging mold musangano, mapoto nemapunga anoshanda pamwechete kuti ave nechokwadi chekubudirira kweiyo encapsulation process. Idzo hari dzinobata iyo encapsulant zvinhu panzvimbo, nepo plungers inoshandisa kumanikidza kuti ive nechokwadi chekuti zvinhu zvinozadza mhango yekuumbwa. Uku kusanganiswa kwemapoto nemaplungers akagadzirwa kubva ku tungsten carbide kunobatsira mukuwana yemhando yepamusoro encapsulation ine hurema hudiki uye inova nechokwadi chekuvimbika kweyakaputirwa semiconductor zvishandiso.

Mukupedzisa, mapoto nemaplungers akagadzirwa kubva ku tungsten carbide zvinhu zvakakosha zve semiconductor packaging mold musangano. Idzo hari dzinopa chigadziko chekubata iyo encapsulant zvinhu, nepo plungers inoshandisa kumanikidza kuti ive nechokwadi cheunifomu encapsulation. Nekushandisa mapoto emhando yepamusoro uye maplungers akagadzirwa kubva ku tungsten carbide, semiconductor packaging vagadziri vanogona kuwana yakavimbika encapsulation uye kuve nechokwadi chemhando uye kuvimbika kwemidziyo yavo yakaputirwa semiconductor.

Izvo zvakakosha kuti unzwisise basa rakakosha remapoto uye plungers mune semiconductor packaging mold musangano. Nekupa mapoto emhando yepamusoro nemaplungers akagadzirwa kubva ku tungsten carbide, Zhuzhou Better Tungsten Carbide kambani inogona kubatsira vatengi muindasitiri yemagetsi kuwana yakavimbika uye yepamusoro-inoshanda semiconductor packaging mold. Unyanzvi hwedu mukugadzira tungsten carbide uye kuzvipira kwedu kune mhando kunoita kuti tive shamwari yakavimbika kune semiconductor packaging mold musangano mhinduro.