Karolo ea lipitsa le li-plungers kopanong ea hlobo ea semiconductor packaging

 Ho paka ka semiconductor ke ts'ebetso ea bohlokoa indastering ea elektroniki, moo lipotoloho tse kopaneng li koaletsoeng ho li sireletsa linthong tse kantle tse kang mongobo, lerōle le tšenyo ea 'mele. Karolo e 'ngoe ea bohlokoa ea ho kopanya hlobo ea semiconductor ke lipitsa le li-plungers tse entsoeng ka tungsten carbide. Likarolo tsena li bapala karolo ea bohlokoa ho netefatsa boleng le ts'epahalo ea ts'ebetso ea liphutheloana tsa semiconductor.

  Tungsten carbide ke thepa e tšoarellang haholo ebile e sa aparoe e loketseng ho etsa lipitsa le li-plungers tse sebelisoang ka har'a liphutheloana tsa semiconductor. Boima bo phahameng le matla a tungsten carbide e etsa hore e tšoanelehe ho mamella likhatello tse phahameng le mocheso o amehang ts'ebetsong ea ho paka ka semiconductor. Ho feta moo, tungsten carbide e na le conductivity e ntle ea mocheso, e thusang ho boloka kabo e tšoanang ea mocheso nakong ea ts'ebetso ea encapsulation.

Lipitsa le li-plungers ke likarolo tsa bohlokoa tsa kopano ea hlobo e sebelisoang ho paka ka semiconductor. Lipitsa li sebelisetsoa ho tšoara lisebelisoa tsa encapsulant, tse kang epoxy resin kapa molding compound, nakong ea ts'ebetso ea ho kopanya. Li-plungers, ka lehlakoreng le leng, li sebelisetsoa ho sebelisa khatello ho thepa ea encapsulant ho etsa bonnete ba hore e tlatsa mokoti oa hlobo ka ho feletseng le ka mokhoa o ts'oanang. Ka bobeli lipitsa le li-plungers li bohlokoa bakeng sa ho fihlella encapsulation ea boleng bo holimo le ho netefatsa ho ts'epahala ha lisebelisoa tsa semiconductor tse pakiloeng.

Karolo ea lipitsa kopanong ea semiconductor packaging hlobo ke ho fana ka setshelo sa ho ts'oara thepa ea encapsulant. Hangata lipitsa li entsoe ka tungsten carbide ka lebaka la boima ba tsona bo phahameng le ho hanyetsa ho roala, e leng se tiisang hore lipitsa li khona ho mamella tlhaho ea abrasive ea thepa ea encapsulant. Lipitsa li etselitsoe ho ba le litekanyo tse nepahetseng le ho qeta holimo ho etsa bonnete ba hore thepa ea encapsulant e phalla hantle le ka mokhoa o lekanang nakong ea ts'ebetso ea encapsulation. Sena se thusa ho thibela li-voids, li-bubble tsa moea le liphoso tse ling ho lisebelisoa tsa semiconductor tse kentsoeng.

Li-plungers li bapala karolo ea bohlokoa ho bokelleng hlobo ea semiconductor ka ho sebelisa khatello ho thepa ea encapsulant ho netefatsa hore e tlatsa sekoti sa hlobo. Li-plungers li etselitsoe ho lekana hantle le lipitsa ho etsa tiiso e tiileng le ho thibela ho lutla ha thepa ea encapsulant. Li-plungers tsa Tungsten carbide li ratoa ka lebaka la matla a tsona a phahameng le ho tšoarella ha tsona, tse li lumellang ho sebelisa khatello e hlokahalang ntle le ho holofala kapa ho robeha nakong ea ts'ebetso ea encapsulation. Taolo e nepahetseng ea khatello ea li-plungers e thusa ho fihlella encapsulation e ts'oanang le ho netefatsa boleng le ts'epahalo ea lisebelisoa tsa semiconductor tse pakiloeng.

Kopanong ea hlobo ea semiconductor packaging, lipitsa le li-plunger li sebetsa 'moho ho netefatsa katleho ea ts'ebetso ea encapsulation. Lipitsa li tšoara thepa ea encapsulant sebakeng, ha li-plungers li sebelisa khatello ho netefatsa hore thepa e tlatsa mokoti oa hlobo. Motsoako ona oa lipitsa le li-plungers tse entsoeng ka tungsten carbide li thusa ho fihlella encapsulation ea boleng bo holimo e nang le mefokolo e nyane mme e netefatsa ts'epo ea lisebelisoa tsa semiconductor tse pakiloeng.

Qetellong, lipitsa le li-plungers tse entsoeng ka tungsten carbide ke likarolo tsa bohlokoa tsa kopano ea hlobo ea semiconductor packaging. Lipitsa li fana ka setshelo bakeng sa ho ts'oara thepa ea encapsulant, ha li-plungers li sebelisa khatello ho netefatsa hore li-encapsulation li lekana. Ka ho sebelisa lipitsa tsa boleng bo holimo le li-plungers tse entsoeng ka tungsten carbide, baetsi ba liphutheloana tsa semiconductor ba ka fihlela encapsulation e tšepahalang le ho netefatsa boleng le ts'epahalo ea lisebelisoa tsa bona tse pakiloeng tsa semiconductor.

Ha e le hantle ke ho utloisisa karolo ea bohlokoa ea lipitsa le li-plungers kopanong ea hlobo ea semiconductor packaging. Ka ho fana ka lipitsa tsa boleng bo holimo le li-plungers tse entsoeng ka tungsten carbide, k'hamphani ea Zhuzhou Better Tungsten Carbide e ka thusa bareki ba indasteri ea lisebelisoa tsa elektroniki ho fihlela hlobo e tšepahalang le e phahameng ea ts'ebetso ea semiconductor. Tsebo ea rona ea ho etsa tungsten carbide le boitlamo ba rona ba boleng bo re etsa molekane ea tšepahalang bakeng sa tharollo ea kopano ea hlobo ea semiconductor packaging.