Indima yeembiza kunye ne-plunger kwindibano yokubumba i-semiconductor yokupakisha

 Ukupakishwa kwe-Semiconductor yinkqubo ebalulekileyo kwishishini le-elektroniki, apho iisekethe ezidibeneyo zihlanganiswe ukuze zikhuseleke kwizinto zangaphandle ezifana nokufuma, uthuli kunye nomonakalo womzimba. Elinye icandelo eliphambili le-semiconductor yokupakisha i-mold assembly ziimbiza kunye ne-plungers ezenziwe kwi-tungsten carbide. La macandelo adlala indima ebalulekileyo ekuqinisekiseni umgangatho kunye nokuthembeka kwenkqubo yokupakisha ye-semiconductor.

  I-Tungsten carbide yinto ehlala ixesha elide kwaye inganxibi, ilungele ukwenza iimbiza kunye neeplungers ezisetyenziswa kwipakethe ye-semiconductor. Ubunzima obuphezulu kunye namandla e-tungsten carbide yenza ukuba ilungele ukumelana noxinzelelo oluphezulu kunye namaqondo okushisa abandakanyekayo kwinkqubo yokupakisha i-semiconductor. Ukongezelela, i-tungsten carbide ine-conductivity egqwesileyo ye-thermal, enceda ekugcineni ukusabalalisa ukushisa okufanayo ngexesha lenkqubo ye-encapsulation.

Iimbiza kunye ne-plunger zizinto ezibalulekileyo zendibano yokubumba esetyenziselwa ukupakishwa kwe-semiconductor. Iimbiza zisetyenziselwa ukubamba izinto ze-encapsulant, ezifana ne-epoxy resin okanye i-compound molding, ngexesha lenkqubo ye-encapsulation. I-plunger, ngakolunye uhlangothi, isetyenziselwa ukufaka uxinzelelo kwizinto ze-encapsulant ukuqinisekisa ukuba izalise i-mold cavity ngokupheleleyo kwaye ngokufanayo. Zombini iimbiza kunye neeplungers zibalulekile ekufezekiseni i-encapsulation ekumgangatho ophezulu kunye nokuqinisekisa ukuthembeka kwezixhobo ezipakishiweyo ze-semiconductor.

Indima yeembiza kwindibano yokubumba i-semiconductor yokupakisha kukubonelela ngesitya sokubamba izinto ze-encapsulant. Iimbiza ngokuqhelekileyo zenziwe kwi-tungsten carbide ngenxa yobunzima obuphezulu kunye nokumelana nokugqoka, okuqinisekisa ukuba iimbiza ziyakwazi ukumelana nemvelo enqabileyo yezinto ze-encapsulant. Iimbiza zenzelwe ukuba zibe nemilinganiselo echanekileyo kunye nokugqitywa komphezulu wokuqinisekisa ukuba izinto ze-encapsulant zihamba kakuhle kwaye zihamba kakuhle ngexesha lenkqubo ye-encapsulation. Oku kunceda ekuthinteleni i-voids, amaqamza omoya, kunye nezinye iziphene kwizixhobo ezifakwe kwi-semiconductor.

I-Plungers idlala indima ebalulekileyo kwi-semiconductor yokupakisha indibano yokungunda ngokufaka uxinzelelo kwimathiriyeli ye-encapsulant ukuqinisekisa ukuba igcwalisa umngxuma wokungunda. Iiplunger ziyilelwe ukuba zilingane ngokuchanekileyo kunye neembiza ukwenza itywina eliqinileyo kunye nokuthintela nakuphi na ukuvuza kwempahla ye-encapsulant. I-tungsten carbide plunger ikhethwa ngamandla abo aphezulu kunye nokuqina, okubavumela ukuba basebenzise uxinzelelo oluyimfuneko ngaphandle kokuguqulwa okanye ukuphuka ngexesha lenkqubo ye-encapsulation. Ukulawulwa ngokuchanekileyo koxinzelelo ngama-plungers kunceda ukufezekisa i-encapsulation efanayo kunye nokuqinisekisa umgangatho kunye nokuthembeka kwezixhobo ze-semiconductor ezipakishweyo.

Kwi-semiconductor packaging mold assembly, iimbiza kunye ne-plunger zisebenza kunye ukuqinisekisa impumelelo yenkqubo ye-encapsulation. Iimbiza zibamba i-encapsulant material endaweni, ngelixa i-plunger ifaka uxinzelelo ukuqinisekisa ukuba izinto zizalise i-mold cavity. Olu dibaniso lweembiza kunye ne-plunger ezenziwe kwi-tungsten carbide inceda ekufezekiseni i-encapsulation ephezulu kunye neziphene ezincinci kwaye iqinisekisa ukuthembeka kwezixhobo ze-semiconductor ezipakishweyo.

Ukuqukumbela, iimbiza kunye ne-plunger ezenziwe kwi-tungsten carbide zizinto ezibalulekileyo ze-semiconductor packaging mold assembly. Iimbiza zibonelela ngesitya sokubamba i-encapsulant material, ngelixa i-plunger ifaka uxinzelelo ukuqinisekisa ukubethelwa okufanayo. Ngokusebenzisa iimbiza ezikumgangatho ophezulu kunye neeplungers ezenziwe kwi-tungsten carbide, abavelisi be-semiconductor ukupakisha banokufikelela kwi-encapsulation ethembekileyo kwaye baqinisekise umgangatho kunye nokuthembeka kwezixhobo zabo ze-semiconductor ezipakishweyo.

Kubaluleke kakhulu ukuqonda indima ebalulekileyo yeembiza kunye neeplungers kwindibano yokungunda yokupakishwa kwesemiconductor. Ngokubonelela ngeembiza ezikumgangatho ophezulu kunye neeplunger ezenziwe kwi-tungsten carbide, inkampani yaseZhuzhou iBetter Tungsten Carbide inokunceda abathengi kwishishini le-elektroniki bafezekise ukubumba okuthembekileyo kunye nokusebenza okuphezulu kwe-semiconductor yokupakisha. Ubuchwephesha bethu kwimveliso ye-tungsten carbide kunye nokuzinikela kwethu kumgangatho kusenza sibe liqabane elithembekileyo lezisombululo zendibano yokubumba i-semiconductor yokupakisha.